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Yamaha Announces Silicon Microphones for Use in Mobile Phones and Other Portable Devices
— Featuring Compactness and Reflow Soldering Mountability — |
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Yamaha Silicon Microphone YAM551
Sample price: ¥210 (including tax) |
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| Yamaha Corporation (Head Office: 10-1, Nakazawa-cho, Hamamatsu-shi, Shizuoka; President: Shuji Ito) has announced the development of silicon microphones "YAM551/YAM552" for use in mobile phones and other portable devices, and sample shipments will begin on March 12, 2007. |
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| Sample Price and Date Sample Sales Begin |
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| Product Name |
Product Number |
Sample Price |
Date of First Shipments |
| Yamaha Silicon Microphone |
YAM551/YAM552 |
¥210 (including tax) |
March 12 (Monday) |
Expected Sales: 500,000 units per month
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| Product Description |
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The recently developed YAM551/YAM552, shipments of which will begin shortly, are mountable using the same reflow soldering mounting process (See note 1) that is employed for LSIs in general. Since these microphones are compact and thin, considerable demand is expected for their use in portable devices where space-saving features are strongly needed, as in mobile phones, PDAs, game consoles, cameras, camcorders, and other devices. In addition, Yamaha has announced two models to meet differing onboard system requirements, the YAM551, without a built-in amplifier, and the YAM552, which has a built-in amplifier. |
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| Market Information |
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Silicon microphones make use of MEMS (Micro Electro Mechanical Systems) technology (See note 2) and employ a silicon diaphragm mounted on a silicon plate that vibrates with acoustic pressure. These microphones are compact and their use makes it possible to reduce costs through mounting on the silicon plate surface. Therefore, demand for these units in portable devices, including mobile phones, is expected to rise. |
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| Development Information |
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Yamaha began the basic development of MEMS in 2002 and commenced the development of silicon microphones in 2004. Drawing on its semiconductor manufacturing technology, circuit design technology, and acoustic design technology, Yamaha succeeded in developing its silicon microphones in relatively short period.
Yamaha has a broad lineup of audio LSI products, including mobile audio LSI chips, as well as analog and digital audio signal processing technology. Going forward, Yamaha will aim to draw on its experience and technology in these areas to develop high-value-added microphone systems to meet a range of needs for noise reduction, directionality control, and other features. |
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| Principal Features |
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The YAM551 and YAM552 units combine a MEMS condenser microphone chip and LSI chips in a single package. They are ultra-compact silicon microphones with single-channel analog output and differ from electret condenser microphones that are in common use. Silicon microphones make use of a thin silicon membrane on the diaphragm, and, as a result, they have a high resistance to heat and can be mounted using the reflow soldering mounting process, thus realizing lower mounting costs. Also, since the diaphragm is compact and light, it has a high signal to noise ratio.
The YAM551 and YAM552 adopt a MEMS structure, which is compatible with existing LSI manufacturing processes. In addition, as a result of Yamaha's innovative vibrator plate structure and vibrator design, it features both simplicity and practical performance.
- One-channel analog audio output (omnidirectional)
- Can be mounted with the reflow soldering process
- Compact, thin package that increases degree of freedom in basket layouts
- YAM551 does not have an internal amplifier.
- YAM552 has an internal amplifier that can be set between 0 and 20 dB using an externally mounted resistor and condenser.
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| Other Specifications |
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| Power supply voltage |
1.5V to 3.6V |
| Sensitivity |
-42dBV/Pa (1kHz, 94dBSPL) |
| Signal to noise ratio |
55dB (1kHz, 94dBSPL) |
| Package size |
4-pin CSON (See note 3), 4.3mm x 3.4mm x 1.28mm |
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| Notes |
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| 1. |
Reflow soldering mounting process |
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A process for electrically and mechanically mounting electronic parts on printed circuit boards (PCBs). Under this process, soldering paste is applied in advance to points that will be bonded, and, after preliminary mounting, the PCBs are heated in a reflow furnace to complete solder bonding.
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| 2. |
MEMS (Micro Electro Mechanical Systems) |
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MEMS is a general term for movable mechanical structures on silicon plates that make use of sensors, actuators, and other components. MEMS technology has been applied in pressure sensors, acceleration sensors, and other uses.
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| 3. |
CSON |
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Stands for Ceramic Small Outline Non-leaded package. |
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